US Patent Issued to Medtronic on Feb. 25 for "Electronic package and implantable medical device including same" (Arizona Inventors)

ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 12,237,281, issued on Feb. 25, was assigned to Medtronic Inc. (Minneapolis).

"Electronic package and implantable medical device including same" was invented by Mark E. Henschel (Phoenix) and Songhua Shi (Tempe, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate ...