US Patent Issued to Medtronic on April 8 for "Telescoping capsule assembly for transcatheter valve repair and methods" (California Inventors)

ALEXANDRIA, Va., April 9 -- United States Patent no. 12,268,602, issued on April 8, was assigned to Medtronic Inc. (Minneapolis).

"Telescoping capsule assembly for transcatheter valve repair and methods" was invented by Ryan J. Bienvenu (Santa Rosa, Calif.), Grant A. Menon (Santa Rosa, Calif.), Fatemeh Fatemi Far (Santa Rosa, Calif.) and Sabrina Hua (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the disclosure provide a cardiac implant delivery device including catheter having a distal end and a telescoping capsule assembly secured to the distal end. The capsule assembly can include a distal capsule and a proximal capsule. Other embodiments include additional capsules positioned bet...