ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,424,531, issued on Sept. 23, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Semiconductor package structure" was invented by Tzu-Hung Lin (Hsinchu, Taiwan) and Yuan-Chin Liu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure is provided. The semiconductor package structure includes a first substrate having a first wiring structure; and a second substrate having a second wiring structure, wherein the first substrate and the second substrate are arranged side-by-side, and the first substrate and the second substrate are surrounded and separated by a molding material. The semiconductor package structure al...