ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,109, issued on Oct. 7, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Semiconductor package and manufacturing method thereof" was invented by Yan-Liang Ji (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate, a first insulation layer, a conductive pad, a second insulation layer and a conductive trace. The first insulation layer is formed on the substrate and having a first through hole. The conductive pad is formed on the substrate through the first through hole. The second insulation layer has a first surface and a second through hole, wherein the second through hole extends to the conductiv...