US Patent Issued to MediaTek on Oct. 14 for "Semiconductor package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,715, issued on Oct. 14, was assigned to MediaTek Inc. (Hsinchu, Taiwan).

"Semiconductor package structure" was invented by Yi-Lin Tsai (Hsinchu, Taiwan), Wen-Sung Hsu (Hsin-Chu, Taiwan), I-Hsuan Peng (Hsinchu, Taiwan) and Yi-Jou Lin (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a substrate, a redistribution layer, a first semiconductor component, a conductive pillar, and a second semiconductor component. The redistribution layer is over the substrate. The first semiconductor component is over the redistribution layer. The conductive pillar is adjacent to the first semiconductor component, ...