ALEXANDRIA, Va., June 16 -- United States Patent no. 12,309,921, issued on May 20, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Board-level pad pattern for multi-row QFN packages" was invented by Hui-Chi Tang (Hsinchu, Taiwan), Shao-Chun Ho (Hsinchu, Taiwan), Hsuan-Yi Lin (Hsinchu, Taiwan) and Pu-Shan Huang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A board-level pad pattern includes a printed circuit board (PCB) substrate; an exposed pad region disposed within a surface mount region of the base substrate; and multiple staggered ball pads disposed within the surface mount region arranged in a ring shape around the exposed pad region. The staggered ball pads includes first ball pads ...