ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,573, issued on May 13, was assigned to MediaTek Inc. (Hsin-Chu, Taiwan).
"Semiconductor device and manufacturing method thereof" was invented by Bo-Jiun Yang (Hsinchu, Taiwan), Wen-Sung Hsu (Hsinchu, Taiwan), Tai-Yu Chen (Hsinchu, Taiwan), Sheng-Liang Kuo (Hsinchu, Taiwan) and Chia-Hao Hsu (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate, an electronic component, a cover and a liquid metal. The electronic component is disposed on the substrate. The cover is disposed on the substrate and covers the electronic component. The liquid metal is formed between the cover and the electronic component...