US Patent Issued to MediaTek on June 17 for "Semiconductor package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,444, issued on June 17, was assigned to MediaTek Inc. (Hsinchu, Taiwan).

"Semiconductor package structure and method for forming the same" was invented by Po-Hao Chang (New Taipei, Taiwan), Yi-Jou Lin (Hsinchu, Taiwan) and Hung-Chuan Chen (Hsin-Chu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a first semiconductor die and a second semiconductor die neighboring the first semiconductor die. The first semiconductor die includes a first edge, a second edge opposite the first edge, and a first metal layer exposed from the second edge. The second semiconductor includes a third edge neighboring the secon...