ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,758, issued on Jan. 20, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Board-level pad pattern for multi-row QFN packages" was invented by Hui-Chi Tang (Hsinchu, Taiwan), Shao-Chun Ho (Hsinchu, Taiwan), Hsuan-Yi Lin (Hsinchu, Taiwan) and Pu-Shan Huang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A board-level pad pattern includes a corner pad unit disposed at a corner of a surface mount region for mounting a multi-row QFN package. The corner pad unit includes at least a reversed-L-shaped pad. The reversed-L-shaped pad is disposed in proximity to an apex of the corner of the surface mount region."
The patent was filed on Dec. 8...