ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,549, issued on Jan. 13, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Semiconductor package structure" was invented by Tzu-Hung Lin (Zhubei, Taiwan), Chia-Cheng Chang (Hsinchu, Taiwan), I-Hsuan Peng (Hsinchu, Taiwan) and Nai-Wei Liu (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a base having a first surface and a second surface opposite thereto, wherein the base comprises a wiring structure, a first electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, a second electronic component disposed over the first surface of the bas...