US Patent Issued to MediaTek on Jan. 13 for "Semiconductor package assembly and electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 13 -- United States Patent no. 12,525,582, issued on Jan. 13, was assigned to MediaTek Inc. (Hsinchu, Taiwan).

"Semiconductor package assembly and electronic device" was invented by Li-Huan Chu (Hsinchu, Taiwan), Kai-Che Cheng (Hsinchu, Taiwan), Ming-Tsung Lin (Hsinchu, Taiwan), Sheng-Feng Liu (Hsinchu, Taiwan) and Chi-Ko Yu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package assembly and an electronic device are provided. The semiconductor package assembly includes a base, a system-on-chip (SOC) package, a memory package and a silicon capacitor die. The base has a first surface and a second surface opposite the first surface. The SOC package is dispo...