ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,560, issued on Feb. 18, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Semiconductor package structure" was invented by Che-Hung Kuo (Hsinchu, Taiwan), Hsing-Chih Liu (Hsinchu, Taiwan) and Tai-Yu Chen (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a frontside redistribution layer, a first semiconductor die, a first capacitor, a conductive terminal, and a backside redistribution layer. The first semiconductor die is disposed over the frontside redistribution layer. The first capacitor is disposed over the frontside redistribution layer and electrically coupled to the first semiconductor d...