US Patent Issued to MediaTek on Dec. 16 for "Semiconductor package with integrated antenna and shielding pillars" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,180, issued on Dec. 16, was assigned to MediaTek Inc. (Hsinchu, Taiwan).

"Semiconductor package with integrated antenna and shielding pillars" was invented by Tzu-Hung Lin (Hsinchu, Taiwan), Chih-Ming Hung (San Jose, Calif.) and Shih-Chia Chiu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base film, a semiconductor die on the base film, metal studs on the semiconductor die, shielding pillars on the base film and around the semiconductor die, a first molding compound encapsulating the semiconductor die, the metal studs, and the shielding pillars, a first re-distribution structure on the first moldi...