ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,944, issued on Aug. 26, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Board-level pad pattern for multi-row QFN packages" was invented by Hui-Chi Tang (Hsinchu, Taiwan), Hsuan-Yi Lin (Hsinchu, Taiwan), Shao-Chun Ho (Hsinchu, Taiwan), Yi-Wen Chiang (Hsinchu, Taiwan) and Pu-Shan Huang (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A board-level pad pattern includes staggered ball pads disposed within a surface mount region for mounting a multi-row QFN package. The staggered ball pads include first ball pads arranged in a first row and second ball pads arranged in a second row. The first ball pads in the first row are arranged at t...