ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,026, issued on Aug. 12, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Electronic package with rotated semiconductor die" was invented by Yao-Chun Su (Hsinchu, Taiwan), Chih-Jung Hsu (Hsinchu, Taiwan), Yi-Jou Lin (Hsinchu, Taiwan) and I-Hsuan Peng (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package includes a base of a rectangular shape, and a chip package including a first interface circuit die and a second interface circuit die. The first interface circuit die and second interface circuit die are mounted on a redistribution layer structure and encapsulated within a molding compound. The chip package is mounted ...