US Patent Issued to MediaTek on Aug. 12 for "Antenna-in-module package-on-package with air trenches" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,388,194, issued on Aug. 12, was assigned to MediaTek Inc. (Hsinchu, Taiwan).

"Antenna-in-module package-on-package with air trenches" was invented by Ya-Jui Hsieh (Hsinchu, Taiwan), Chi-Yuan Chen (Hsinchu, Taiwan), Shih-Chao Chiu (Hsinchu, Taiwan) and Yao-Pang Hsu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna-in-module package-on-package includes an antenna package having a top surface and a bottom surface opposing the top surface. The antenna package includes a radiative antenna element on the bottom surface. A chip package is mounted on the top surface of the antenna package. The chip package includes a semiconductor chip....