US Patent Issued to MAYEKAWA on Sept. 16 for "Slicing device, and method for slicing workpiece" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,414,571, issued on Sept. 16, was assigned to MAYEKAWA MFG. Co. LTD. (Tokyo).

"Slicing device, and method for slicing workpiece" was invented by Ryuji Kodama (Tokyo), Hiroyuki Usui (Tokyo), Seiichiro Umeda (Tokyo), Osamu Goto (Tokyo), Shinji Hane (Tokyo) and Naoki Toyoda (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A slicing device includes cutter device, workpiece holding part, relative movement device, and slicing position operating part. The cutter device has slicing blade that is driven in a direction along a blade surface. The workpiece holding part holds workpiece. The relative movement device moves the workpiece holding part and the cutt...