US Patent Issued to Maxeon Solar on May 20 for "Interconnection configuration for solar module assembly" (California Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,122, issued on May 20, was assigned to Maxeon Solar Pte. Ltd. (Singapore).

"Interconnection configuration for solar module assembly" was invented by Arnaud Lepert (Fremont, Calif.), Ricky Dunbar (Fremont, Calif.) and Lili Wang (Fremont, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor module comprises a string made up of a plurality of cells or strips arranged in series. A front surface of at least one cell or strip, has a polarity opposite to that of the front surface of another cell or strip in the string. In some embodiments the strips may comprise photovoltaic devices of different structures, for example Heterojunction (HJT)...