US Patent Issued to Max on Nov. 25 for "Binding facility, wire feeding mechanism and binding machine" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,613, issued on Nov. 25, was assigned to Max Co. Ltd. (Tokyo).

"Binding facility, wire feeding mechanism and binding machine" was invented by Terufumi Hamano (Tokyo), Kenichi Arai (Tokyo), Yousei Nodaguchi (Tokyo) and Shigeki Shindou (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A binding facility includes: a binding mechanism configured to bind a binding target with a plurality of wires; a reel accommodation part in which a plurality of reels each having one wire wound thereon are accommodated; and a wire feeding mechanism configured to feed each wire from the plurality of reels accommodated in the reel accommodation part to the binding mech...