US Patent Issued to MATERIALS ANALYSIS TECHNOLOGY on March 25 for "Soldering quality inspection method and soldering quality inspection apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,260,541, issued on March 25, was assigned to MATERIALS ANALYSIS TECHNOLOGY INC. (Hsinchu County, Taiwan).

"Soldering quality inspection method and soldering quality inspection apparatus" was invented by Shang-En Wu (Tainan, Taiwan), Keng-Chi Liang (Kaohsiung, Taiwan), Kuang-Tse Ho (Hsinchu County, Taiwan) and Hung-Jen Chen (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A soldering quality inspection method and a soldering quality inspection apparatus are provided. The soldering quality inspection method includes: acquiring an inspection image; calculating, by a processing device, a dyed area percentage of an area of a part of a solderi...