ALEXANDRIA, Va., July 9 -- United States Patent no. 12,356,542, issued on July 8, was assigned to MATERIAL CONCEPT INC. (Sendai, Japan).
"Wiring board and method for manufacturing same" was invented by Junichi Koike (Sendai, Japan) and Tri Hai Hoang (Sendai, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are: a novel wiring board having flexibility derived from a resin board and the high electrical conductivity derived from a metal wiring as well as high adhesion between the metal wiring and the insulating resin board; and a method for manufacturing the wiring board without using a photolithography process. A wiring board according to the present invention comprises a resin board and a metal w...