US Patent Issued to Massachusetts Institute of Technology on March 4 for "Demountable solder joints for coupling superconducting current paths" (American, Australian Inventors)

ALEXANDRIA, Va., March 5 -- United States Patent no. 12,243,682, issued on March 4, was assigned to Massachusetts Institute of Technology (Cambridge, Mass.).

"Demountable solder joints for coupling superconducting current paths" was invented by Brian Labombard (Belmont, Mass.), William Beck (Watertown, Mass.) and Theodore Mouratidis (Melbourne, Australia).

According to the abstract* released by the U.S. Patent & Trademark Office: "Described are concepts directed toward systems, structures and techniques to create low-resistance, high current capacity, demountable solder joint connections. Such systems, structures and techniques may be used to simultaneously create low-resistance, high current capacity, demountable solder joint connections...