US Patent Issued to Massachusetts Institute of Technology, Beth Israel Deaconess Medical Center on Dec. 2 for "Shape memory adhesive materials for diabetic wound healing" (Massachusetts Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,485,202, issued on Dec. 2, was assigned to Massachusetts Institute of Technology (Cambridge, Mass.) and Beth Israel Deaconess Medical Center (Boston).

"Shape memory adhesive materials for diabetic wound healing" was invented by Xuanhe Zhao (Allston, Mass.), Hyunwoo Yuk (Cambridge, Mass.), Heejung Roh (Cambridge, Mass.), Aristidis Veves (Westwood, Mass.) and Georgios Theocharidis (Cambridge, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A shape memory adhesive material for adhering and contracting wounds, particularly diabetic wounds, to facilitate their closure and healing. The shape memory adhesive is pre-stretched and dried to provide an adhesiv...