ALEXANDRIA, Va., June 10 -- United States Patent no. 12,295,094, issued on May 6, was assigned to Marvell Israel (M.I.S.L) Ltd. (Yokne'am, Israel).
"Pad and via pattern arrangement for differential signal shielding" was invented by Dan Azeroual (Kiryat Ata, Israel), Liav Ben Artsi (Nahariya, Israel) and David Katz (Hadera, Israel).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board (PCB) is provided herein, including signal and ground pads on a surface of the PCB. The signal pads are grouped into differential signal pad pairs, where each differential signal pad pair has a midpoint located halfway between the centers of the signal pads of the differential signal pad pair. A first differentia...