US Patent Issued to Marvell Asia on Oct. 28 for "Co-packaging optical modules with surface and edge coupling" (California Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,455,423, issued on Oct. 28, was assigned to Marvell Asia Pte Ltd (Singapore).

"Co-packaging optical modules with surface and edge coupling" was invented by Radhakrishnan L. Nagarajan (San Jose, Calif.) and Mark Patterson (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A co-packaged electro-optical module includes: a first planar light circuit (PLC) block; a silicon photonics chip electrically coupled to one or more chips; a splitter embedded in the first PLC block and to receive laser light from an optical fiber, to split the laser light into two portions, and to provide respective portions of the laser light to two planar waveguides; a...