ALEXANDRIA, Va., June 19 -- United States Patent no. 12,332,310, issued on June 17, was assigned to Marvell Asia Pte Ltd (Singapore).
"Built-in testing in modular system-on-chip device" was invented by Xiongzhi Ning (Karlsruhe, Germany), Yuyi Tang (Karlsruhe, Germany) and Steffen Dolling (Ditzingen, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A system-on-chip integrated circuit device includes a plurality of functional circuit modules, at least a first circuit module of the plurality of functional circuit modules operating under a first protocol, the first protocol being an interface protocol for communicating outside the system-on-chip integrated circuit device, an interconnect fabric coupled to ...