ALEXANDRIA, Va., Aug. 6 -- United States Patent no. D1,087,043, issued on Aug. 5, was assigned to Marvell Asia Pte. Ltd. (Singapore).
"Integrated circuit substrate" was invented by Kapil Vishwas Shrikhande (Berkeley, Calif.) and Yongming Xiong (San Jose, Calif.).
The patent was filed on Sept. 6, 2022, under Application No. D/852,344.
*For further information, including images, charts and tables, please visit: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=D1087043&OS=D1087043&RS=D1087043
Disclaimer: Curated by HT Syndication....