US Patent Issued to Mainstream Engineering on June 10 for "Apparatus for the fabrication of wire-embedded adsorbent structures with bare wire leads" (Florida Inventor)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,657, issued on June 10, was assigned to Mainstream Engineering Corp. (Rockledge, Fla.).

"Apparatus for the fabrication of wire-embedded adsorbent structures with bare wire leads" was invented by Benjamin S. Woods (Melbourne, Fla.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus for the extrusion of a solid wire into a resin or paste is disclosed. The apparatus consists of two main parts including an adapter for constraining the wire until mixing with the resin or paste ('wire injector'), and a motor-driven gear system that feeds the wire into the injector ('wire extruder'). With this system, a bare wire can be extruded allowing for the cr...