US Patent Issued to Magnachip Semiconductor on Nov. 18 for "Wafer level chip scale package of power semiconductor and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,209, issued on Nov. 18, was assigned to Magnachip Semiconductor Ltd. (Cheongju-si, South Korea).

"Wafer level chip scale package of power semiconductor and manufacturing method thereof" was invented by Myungho Park (Cheongju-si, South Korea), Heejin Park (Cheongju-si, South Korea) and Beomsu Kim (Cheongju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wafer level chip scale package includes a semiconductor substrate having a first thickness, an input-output pad formed on the semiconductor substrate, a front metal layer having a second thickness formed on the input-output pad, a back metal layer having a third thickness formed on a ...