ALEXANDRIA, Va., July 23 -- United States Patent no. 12,369,444, issued on July 22, was assigned to MAGIC LEAP INC. (Plantation, Fla.).
"Low profile interconnect for light emitter" was invented by Kevin Curtis (Boulder, Colo.).
According to the abstract* released by the U.S. Patent & Trademark Office: "In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 micro metre or less, or about 35 micro metre or less. This small height allows close spa...