US Patent Issued to MACRONIX INTERNATIONAL on Nov. 25 for "Memory device with source line over a bonding pad" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,227, issued on Nov. 25, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan).

"Memory device with source line over a bonding pad" was invented by Li-Wei Wang (New Taipei, Taiwan), Hong-Ji Lee (Taoyuan, Taiwan), Fu-Xing Zhou (New Taipei, Taiwan) and Shih-Chin Lee (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit structure includes a substrate, a conductive layer, a plurality of memory devices, a bonding pad, and a source line. The conductive layer is over the substrate. The memory devices are stacked in a vertical direction over the conductive layer. The bonding pad is over the conductive layer. The s...