ALEXANDRIA, Va., March 26 -- United States Patent no. RE50,357, issued on March 25, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan).
"Three-dimensional semiconductor device" was invented by Shih-Hung Chen (Hsinchu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D semiconductor device is provided, comprising plural memory layers vertically stacked on a substrate and parallel to each other; plural selection lines disposed on the memory layers and parallel to each other; plural bit lines disposed on the selection lines, and the bit lines arranged in parallel to each other and in perpendicular to the selection lines; plural strings formed vertically to the memory layers and the...