ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,594, issued on June 10, was assigned to MACRONIX International Co. Ltd. (Hsinchu, Taiwan).
"3D flash memory module chip and method of fabricating the same" was invented by Teng-Hao Yeh (Hsinchu County, Taiwan) and Hang-Ting Lue (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A 3D flash memory module chip includes a memory chip and a control chip. The memory chip includes a plurality of tiles and a plurality of heaters. The tiles each include a plurality of 3D flash memory structures. The heaters are disposed around the 3D flash memory structures of each of the tiles. The control chip is bonded with the memory chip to drive at least o...