US Patent Issued to MACOM Technology Solutions Holdings on Oct. 21 for "Packaged semiconductor devices with leadframes having tie bar with recessed cavity" (Malaysian, American Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,413, issued on Oct. 21, was assigned to MACOM Technology Solutions Holdings Inc. (Lowell, Mass.).

"Packaged semiconductor devices with leadframes having tie bar with recessed cavity" was invented by Soon Lee Liew (Ipoh, Malaysia), Eng Wah Woo (Ipoh, Malaysia) and Alexander Komposch (Morgan Hill, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A leadframe blank includes a first package blank, a second package blank and a tie bar between the first package blank and the second package blank. The tie bar includes a recessed cavity therein."

The patent was filed on May 3, 2024, under Application No. 18/654,125.

*For further information, including...