ALEXANDRIA, Va., June 17 -- United States Patent no. 12,315,770, issued on May 27, was assigned to MACOM Technology Solutions Holdings Inc. (Lowell, Mass.).
"Edge encapsulation for high voltage devices" was invented by Timothy Boles (Santa Clara, Calif.), David Hoag (Santa Clara, Calif.), Luis Baez (Santa Clara, Calif.), Margaret Barter (Santa Clara, Calif.) and James Brogle (Santa Clara, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device architecture includes a silicon substrate having sidewalls that are passivated by encapsulating the sidewalls in dielectric materials having high electric field strength. Encapsulating all the sidewalls using high field strength dielectric material...