ALEXANDRIA, Va., Aug. 20 -- United States Patent no. 12,394,733, issued on Aug. 19, was assigned to MACOM Technology Solutions Holdings Inc. (Lowell, Mass.).
"Stacked RF circuit topology" was invented by Basim Noori (San Jose, Calif.), Marvin Marbell (Morgan Hill, Calif.), Kwangmo Chris Lim (San Jose, Calif.) and Qianli Mu (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device package includes a substrate, a first die comprising active electronic components attached to the substrate, and package leads configured to conduct electrical signals between the first die and an external device. At least one integrated interconnect structure is provided on the first die opposite...