US Patent Issued to MacDermid Enthone on June 10 for "Complex waveform for electrolytic plating" (Chinese, American Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,325,927, issued on June 10, was assigned to MacDermid Enthone Inc. (Waterbury, Conn.).

"Complex waveform for electrolytic plating" was invented by Donald Desalvo (Jiangsu Province, China), Ron Blake (Oxford, Conn.), Carmichael Gugliotti (Bristol, Conn.), William J. Decesare (Wolcott, Conn.), Richard A. Bellemare (Watertown, Conn.), James Watkowski (Middlebury, Conn.) and Ernest Long (Burlington, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and blind micro-vias with copper. The method includes the steps of: (1) preparing an...