US Patent Issued to LUMILEDS SINGAPORE on Nov. 25 for "Light emitting diode devices with bonding and/or ohmic contact-reflective material" (Singaporean Inventors)

ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,484,346, issued on Nov. 25, was assigned to LUMILEDS SINGAPORE PTE. LTD. (Singapore).

"Light emitting diode devices with bonding and/or ohmic contact-reflective material" was invented by Wali Zhang (Singapore), Zhan Hong Cen (Singapore), Wee-Hong Ng (Singapore) and Yeow Meng Teo (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metal stack of layers contacting an N-type layer of a light emitting diode (LED) device comprises: an ohmic contact layer electrically contacting the N-type layer and having a work function value that is less than or equal to a work function value of the N-type layer; a reflective layer electrically contacting the ohmic...