US Patent Issued to Lumentum Operations on June 24 for "Method and material for attaching a chip to a submount" (California, Texas Inventors)

ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,119, issued on June 24, was assigned to Lumentum Operations LLC (San Jose, Calif.).

"Method and material for attaching a chip to a submount" was invented by Zhengwei Shi (Houston), Lijun Zhu (Dublin, Calif.) and Jihua Du (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A die attachment material may include an ultra-violet (UV) curable resin and silver particles to attach a chip to a submount, where the silver particles are positioned within the UV curable resin. A method may include heating the die attachment material to obtain the UV curable resin on sintered silver particles, where at least a portion of the die attachment material ...