US Patent Issued to LUMENS on Sept. 30 for "Light-emitting device package for back light and manufacturing method thereof" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,433,076, issued on Sept. 30, was assigned to LUMENS Co. LTD. (Yongin-si, South Korea).

"Light-emitting device package for back light and manufacturing method thereof" was invented by Sung Sik Jo (Yongin-si, South Korea) and Pyeong Guk Kim (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A light-emitting device package includes an LED chip including a substrate having an upper surface, a semiconductor laminate structure formed under the substrate, and a first conductive connection pad and a second conductive connection pad formed under the semiconductor laminate structure, a wavelength conversion member having one surface in contac...