US Patent Issued to LPKF LASER & ELECTRONICS on July 22 for "Method and device for providing through-openings in a substrate and a substrate produced in said manner" (German Inventors)

ALEXANDRIA, Va., July 23 -- United States Patent no. 12,365,051, issued on July 22, was assigned to LPKF LASER & ELECTRONICS SE (Garbsen, Germany).

"Method and device for providing through-openings in a substrate and a substrate produced in said manner" was invented by Robin Alexander Krueger (Hannover, Germany), Norbert Ambrosius (Kevelaer, Germany) and Roman Ostholt (Langenhagen, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate comprises glass, sapphire, silicon and/or aluminosilicate, and has at least one recess or through-opening. The at least one recess or through-opening is formed by anisotropic removal of substrate material by etching a portion of the substrate that has been modified...