ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,227,645, issued on Feb. 18, was assigned to Lotte Chemical Corp. (Seoul, South Korea).
"Polyamide resin composition and molded product comprising same" was invented by Sang Hwa Lee (Uiwang-si, South Korea), Ho Geun Park (Uiwang-si, South Korea) and Yeong Deuk Seo (Uiwang-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A polyamide resin composition of the present invention comprises: approximately 100 parts by weight of a polyamide resin comprising approximately 5 to 40 weight % of an aromatic polyamide resin and approximately 60 to 95 weight % of an aliphatic polyamide resin; approximately 30 to 70 parts by weight of an inorganic filler; ...