US Patent Issued to Lockheed Martin on Dec. 30 for "Semiconductor package with liquid flow-over segmented inset lid" (Delaware, Pennsylvania Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,512,390, issued on Dec. 30, was assigned to Lockheed Martin Corp. (Bethesda, Md.).

"Semiconductor package with liquid flow-over segmented inset lid" was invented by Alexander John Silverman (Wilmington, Del.) and Robert Richard Pearson (Philadelphia).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package is provided. The semiconductor package includes a segmented inset lid that is divided into a primary component and one or more secondary components, with each secondary component being coupled to the primary component by a compliant liquid-tight adhesive; wherein the primary component is a continuous region including i) a first surface, i...