US Patent Issued to Littelfuse Semiconductor (Wuxi) on Jan. 20 for "Clip for a discrete power semiconductor package" (Chinese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,750, issued on Jan. 20, was assigned to Littelfuse Semiconductor (Wuxi) Co. Ltd. (Wuxi, China).

"Clip for a discrete power semiconductor package" was invented by Lucas Zhang (Wuxi, China), Charlie Cai (Wuxi, China) and Jifeng Zhou (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A discrete power semiconductor package includes a semiconductor chip, a heatsink, a first lead, a second lead, and a clip. The heatsink is adjacent the semiconductor chip and draws heat away from the semiconductor chip. The clip binds the semiconductor chip to the heatsink and includes a chip linker, a first terminal, and a second terminal. The chip linker is atop...