US Patent Issued to Littelfuse on Oct. 28 for "Leadframeless electrically isolated power semiconductor package" (Philippine Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,456,674, issued on Oct. 28, was assigned to Littelfuse Inc. (Rosemont, Ill.).

"Leadframeless electrically isolated power semiconductor package" was invented by Tiburcio Maldo (Batangas, Philippines), Robert Ebido (Cavite, Philippines), Arnel Deveza (Laguna, Philippines), Jeff Grozen (Muntinlupa, Philippines) and Roger Cadut (Laguna, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A lead-free power semiconductor package (PSP) includes a substrate, multiple copper leads, a die, and an encapsulant. The substrate has alternating layers of copper and silicon nitride. The copper leads, which are not part of a leadframe, are connected to the substra...