ALEXANDRIA, Va., June 16 -- United States Patent no. 12,308,338, issued on May 20, was assigned to Littelfuse Inc. (Chicago).
"Power substrate assembly with reduced warpage" was invented by Tiburcio A. Maldo (Cebu, Philippines), Rhodri Hughes (Swindon, Great Britain), Robert Ebido (Batangas, Philippines), Jeff Grozen (Muntinlupa, Philippines), Josef Colquin A. Chua (Batangas, Philippines) and Domingo Atienza Jr. (Batangas, Philippines).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate assembly may include a power substrate, a chip, a clip, and a trimetal. The power substrate has a first direct copper bonded (DCB) surface connected to a ceramic tile. The chip is soldered onto the first DCB surface. Th...