US Patent Issued to Littelfuse on Feb. 3 for "Method to connect power terminal to substrate within semiconductor package" (British, German Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,611, issued on Feb. 3, was assigned to Littelfuse Inc. (Rosemont, Ill.).

"Method to connect power terminal to substrate within semiconductor package" was invented by Thomas Spann (Furth, Germany) and Elaheh Arjmand (Chippenham, Great Britain).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing a power semiconductor device in accordance with an embodiment of the present disclosure may include providing a substrate disposed atop a heatsink, electrically connecting a semiconductor die to a top surface of the substrate, disposing a thin metallic layer atop the substrate, disposing a terminal atop the thin metallic layer, and performin...