US Patent Issued to Littelfuse on Dec. 16 for "Solderless and pressure contact connection" (Philippine, British Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,151, issued on Dec. 16, was assigned to Littelfuse Inc. (Rosemont, Ill.).

"Solderless and pressure contact connection" was invented by Tiburcio A Maldo (Cebu, Philippines), Rhodri Hughes (Swindon, Great Britain), Robert Ebido (Batangas, Philippines), Jeff Grozen (Muntinlupa, Philippines), Josef Colquin A. Chua (Batangas, Philippines) and Domingo Atienza Jr. (Batangas, Philippines).

According to the abstract* released by the U.S. Patent & Trademark Office: "A pressure contact assembly includes a power substrate, a chip, and a lead. The power substrate has a surface connected to a ceramic tile and a cavity. The chip is soldered to the surface. The lead is to be inserted into the ca...