ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,616, issued on Sept. 23, was assigned to LITE-ON TECHNOLOGY Corp. (Taipei, Taiwan).
"Optoelectronic package structure" was invented by Cheng-Han Wang (New Taipei, Taiwan), Cheng-Hong Su (Taipei, Taiwan) and Chih-Li Yu (New Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes at least one optoelectronic device, a lead frame, and an encapsulant. The optoelectronic device is disposed on the lead frame. The lead frame includes at least one lead unit that includes a first lead and a second lead. The first lead has a first bonding part and a first pin. The first bonding part has a f...