ALEXANDRIA, Va., June 16 -- United States Patent no. 12,310,158, issued on May 20, was assigned to LITE-ON TECHNOLOGY Corp. (Taipei, Taiwan).

"Optoelectronic package structure" was invented by Chen-Hsiu Lin (New Taipei, Taiwan), Bo-Jhih Chen (New Taipei, Taiwan) and Chien-Shun Huang (Changhua County, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier, a metal member, an insulating layer, an optoelectronic element, and an adhesive. The metal member is disposed on the carrier. The insulating layer is disposed on the metal member. The insulating layer has a plurality of grooves, and a carrying region is d...